(800) 348-9250

US Quick Turn PCBs

US QuickTurn Printed Circuit Boards Ideal when your prototype printed circuit boards are small (e.g. less than 30 square inches), you only need a few (e.g. less than 20) and you need them soon (1 or 2 days).
  • PCBs are Manufactured in our US facilities
  • Free electrical test & no tooling charges
  • Includes Full DFM Design Review
  • Fast 1-2 Day Turns

US Full Service PCBs

US Full Service Printed Circuit Boards Recommended for multilayer (2-14 layers) printed circuit boards and quick turn around time.
  • Manufactured in the US
  • Cutting Edge Technology
  • Same Day & Weekend Turns available
  • Mil spec & ITAR compliant circuit boards

Offshore PCBs

Offshore Printed Circuit Boards Best value for custom printed circuit boards (e.g. immersion gold) or larger quantities (e.g. more than 20) and when the lead time is not too critical (e.g. 5 days).
  • State-of-the-Art Facilities
  • Best Prices. Prototype & Production quantities
  • Free Electrical Test & No Tooling Charges
  • Manufactured in China and Taiwan facilities

Custom Quote

Ideal for specific material requirements and custom board specifications.
  • Controlled Impedance
  • High temperature, high frequency material
  • Aluminum and other special materials
  • RoHs Compliant ISO-9001 and UL certified

Printed Circuit Board Assembly Services

Printed Circuit Board Assembly
Recommended for multilayer (2-14 layers) printed circuit boards and quick turn around time.
  • SMT and thru-hole quick turn PCB assembly
  • No minimum or maximum quantity
  • PCBs assembled in as little as 24 hours
  • Guaranteed on-time delivery

US QuickTurn Printed Circuit Boards

• Smart DFM File Check - eliminate CAM holds
NO EXTRA CHARGE
• Any Drill Size between 0.008" and 0.350" NO EXTRA CHARGE
• Internal Cutouts - Plated or Non Plated NO EXTRA CHARGE
• Complex Board Shapes NO EXTRA CHARGE
• Electrical Testing included NO EXTRA CHARGE
• Green Soldermask - Top and Bottom NO EXTRA CHARGE
• White Silkscreen - Top, Bottom or both NO EXTRA CHARGE
• Your choice of HASL or OSP RoHS NO EXTRA CHARGE

Our high quality prototype printed circuit boards are manufactured for quick-turn delivery. We offer a prototype-production quality PCB builds including green solder mask resist, HASL or OSP (RoHS) finish, white silk screen legend, and even expedited delivery.

What are the standard printed circuit board features?
Available PCB Layer counts are 2, 4, 6, 8 and 10 layers.

0.062" Thick
Minimum line and space = 0.005"
Minimum finished drill size = 0.008"
Maximum finished drill size = 0.350"
Green SolderMask both sides.
Copper Weight (outer) = 1 oz
Copper Weight (inner) = 0.5 oz
White SilkScreen Top, Bottom or Both
HASL or OSP (RoHS) finish
Electrical test included
Irregular board shape is OK
Internal cutouts are OK
Electrical test comes included with all multi-layer (4-8 layers) prototype circuit boards.

What Add-Ons are available for the US Quickturn Service?
To keep our cost low for our customers, our online service does not allow add-ons.
Please submit your files with a Request for Custom Quote

What is the standard shipping schedule for 2 layer PCBs?
For orders received by Noon PST the following business day is Day 1.

Shipping schedule for 1 Business Day orders:
Orders received by Noon Monday will ship Tuesday.
Orders received by Noon Tuesday will ship Wednesday.
Orders received by Noon Wednesday will ship Thursday.
Orders received by Noon Thursday will ship Friday.
Orders received by Noon Friday will ship Monday.

Shipping schedule for 2 Business Days orders:
Orders received by Noon Monday will ship Wednesday.
Orders received by Noon Tuesday will ship Thursday.
Orders received by Noon Wednesday will ship Friday.
Orders received by Noon Thursday will ship Monday.
Orders received by Noon Friday will ship Tuesday.

What is the shipping schedule for 4, 6, 8 and 10 layer PCBs?
For orders received by Midnight PST the following business day is Day 1.

Shipping schedule for 3 Business Days orders:
Orders received by Midnight Monday will ship Thursday.
Orders received by Midnight Tuesday will ship Friday.
Orders received by Midnight Wednesday will ship Monday.
Orders received by Midnight Thursday will ship Tuesday.
Orders received by Midnight Friday will ship Wednesday.

Shipping schedule for 4 Business Days orders:
Orders received by Midnight Monday will ship Friday.
Orders received by Midnight Tuesday will ship Monday.
Orders received by Midnight Wednesday will ship Tuesday.
Orders received by Midnight Thursday will ship Wednesday.
Orders received by Midnight Friday will ship Thursday.

Shipping schedule for 5 Business Days orders:
Orders received by Midnight Monday will ship Monday.
Orders received by Midnight Tuesday will ship Tuesday.
Orders received by Midnight Wednesday will ship Wednesday.
Orders received by Midnight Thursday will ship Thursday.
Orders received by Midnight Friday will ship Friday.

Please keep in mind, add 1 lead-time process day for major US Holidays.
Major US Holidays do not count as a Business Day.

What are the US Quickturn PCBs prices?
Standard prices are based on square inch size of your prototype circuit board and board layer count (2, 4, 6, 8 and 10 layers).
We will accept your files and Request for Custom Quote for anything you are not sure about.

What types of payments do you accept?
Payment terms are by credit card transactions through US Quickturn PCBs website only. We accept Visa, MasterCard, and American Express.
Bank card transactions are processed electronically through US Quickturn PCBs secure SSL web site.

If you have more questions, please contact our Technical Experts at support@pcbunlimited.com

Specs

What is the US QuickTurn PCB manufacturing policy?

1. Orders are not guaranteed to be accepted by us until your files pass our Smart DFM review.

2. We prefer that you pass your design through Smart DFM. This way, you can correct any errors that you find. At the end of the Smart DFM process, you can save a .ezq file. If there are no errors, then we can manufacture your quickturn prototype printed circuit boards directly from the .ezq file. If you get stuck in the middle of the Smart DFM process, you can save and submit your .ezq file to us for additional help.

3. While we prefer that you send us a file after passing it through Smart DFM, you can also choose to send us your raw Gerber and Drill files. We will process your files using Smart DFM and send you an email with a detailed result of the Smart DFM checks. If possible, we will edit your files to remove any Smart DFM violations. Our email to you will detail any changes that we've made and we will send a revised .ezq file that you can load into any of our ViewMate family of products. You can review all of the suggested changes that we've made. If you're happy with our changes, then you can ask us to produce your PCB using the supplied .ezq file. However, we recommend that you change your design in your CAD system so that it passes our Smart DFM checks without requiring any alterations.

4. All files will be retained for 3 months.

5. Orders can be shipped anywhere in the world that is served by UPS or FedEx, so long as no US Export restrictions are in force.

6. We reserve the right to change prices and delivery terms at any time.

If your design contains non-plated holes
Smart DFM places plated and non-plated holes on separate layers. If you run your design through Smart DFM, please remember to check the "Non-Plated Through Holes" check box.

If you send us raw Gerber and Drill files, and your design contains both plated and non-plated holes, then we prefer that you place these holes on separate layers. This will ensure that we understand your intent. If you are using ViewMate Deluxe or ViewMate Pro, then you can also submit your data as a .bin file. Name your plated drill layer "PlatedDrills" and your non-plated drill layer "NonPlatedDrills".

QuickTurn Printed Circuit Boards Outlines
Your prototype printed circuit board outline does not have to be square or rectangular. You can submit round boards or boards with a complex shape. Our requirement is that we can convert your outline to a continuous unbroken path. By default, we will rout your board outline with a 0.0625" diameter rout bit. This will result in a minimum radius of approximately 0.032" on inside corners. If your design contains inside corners with radii of less than 0.032", then we will use a 0.03125" diameter rout tool to cut out your board. In this case, inside corners will have a minimum radius of 0.016".

Routing
Default rout tool diameter is 0.0625". 
All features are cut out using this tool if possible (both internal features and the board outline). 

Internal Cutouts
Your design can have both plated and non-plated internal cutouts. We suggest that you add one layer for each type of cutout (plated or non-plated). Just place elements in these layers that are the exact shape of the cutout that you want. For example, if you want a 0.050" x 1.00" slot cutout of the board, then just add a trace of this size to the appropriate layer. If you have a more complex shape, then just submit it as one or more polygons that describe the edge of the cutout. We suggest you draw the polygon with an "F-Type" shape (a line of zero width). If you choose, you can draw the polygons with any width trace. We assume that the centerline of the trace describes the edge of your internal cutout. Plated cutouts will have the inside of the cutout plated with the finish that you choose (Tin/Lead or OSP RoHS). Non-plated cutouts will not have any plating on the internal edges. Name your plated cutouts layer "PlatedInternalRouts". Name your non-plated internal routs "NonPlatedInternalRouts". If you wish, you can also supply a drawing that details the internal cutouts and we will create the needed geometry for you. We prefer to use a 0.0625" rout bit for internal cutouts, although we will use a 0.03125" diameter bit if your design contains features with internal radii of less than 0.032".

Solder Mask Swell and "Minimum Web"
When manufacturing your prototype circuit board, there may be a small misregistration between the solder mask layers and the underlying copper layers. As a result, we recommend that you swell your solder mask layer so that it is 0.005" (0.0025" on a side) larger than the underlying copper elements. This way, if there is a misregistration, then your copper pads will not have any solder mask on them. You should also ensure that your design has a "Minimum Web" of at least 0.003" between adjacent pads. Smart DFM can pinpoint any problem areas for you.

Silk Screen Feature Size
We recommend that your silk screen features have a width of at least 0.007", although the absolute minimum for clear legibility is 0.005". If you submit a Smart DFM file with features that are less than 0.005", then we will simply submit your design for manufacture. There is no guarantee that these narrow features will reproduce correctly. If you submit Gerber data or a .bin file to us, then we will modify your silk screen layers if any features are less than 0.007". If possible, we will set all features so that the minimum trace width is 0.007". Where this is impractical, we will reduce the silk screen feature size to a minimum of 0.005".

Do Printed Circuit Boards UL marking?
By default we add a UL marking to the bottom copper layer:

date code

If the large UL logo will not fit on your prototype circuit board, then we will add the smaller logo shown below:
UL Logo

We add a Date Code, a 3 digit order fragment and a Serial Number to the bottom silk screen layer:

date code

2-LAYER PCB
L1 1oz Cu ----------
.059" DIELECTRIC
L2 1oz Cu ----------

4-LAYER PCB
L1 1oz Cu ----------
.0085" DIELECTRIC
L2 .5oz Cu ----------
.039" DIELECTRIC
L3 .5oz Cu ----------
.0085" DIELECTRIC
L4 1oz Cu ----------

6-LAYER PCB
L1 1oz Cu ----------
.0048" DIELECTRIC
L2 .5oz Cu ----------
.020" DIELECTRIC
L3 .5oz Cu ----------
.0048" DIELECTRIC
L4 .5oz Cu ----------
.020" DIELECTRIC
L5 .5oz Cu ----------
.0048" DIELECTRIC
L6 1oz Cu ----------

8-LAYER PCB
L1 1oz Cu ----------
.005" DIELECTRIC
L2 .5oz Cu ----------
.010" DIELECTRIC
L3 .5oz Cu ----------
.005" DIELECTRIC
L4 .5oz Cu ----------
.010" DIELECTRIC
L5 .5oz Cu ----------
.005" DIELECTRIC
L6 .5oz Cu ----------
.010" DIELECTRIC
L7 .5oz Cu ----------
.005" DIELECTRIC
L8 1oz Cu ----------

10-LAYER PCB
L1 1oz Cu ----------
.005" DIELECTRIC
L2 .5oz Cu ----------
.010" DIELECTRIC
L3 .5oz Cu ----------
.005" DIELECTRIC
L4 .5oz Cu ----------
.010" DIELECTRIC
L5 .5oz Cu ----------
.005" DIELECTRIC
L6 .5oz Cu ----------
.010" DIELECTRIC
L7 .5oz Cu ----------
.005" DIELECTRIC
L8 .5oz Cu ----------
.010" DIELECTRIC
L9 .5oz Cu ----------
.005" DIELECTRIC
L10 1oz Cu ----------

What is the minimum trace width allowed?
The minimum traces width is 0.005" (5 mils).

What is the minimum spacing between traces to copper lands?
The minimum gap between traces and copper lands is 0.005" (5 mils).

What is the minimum annular ring on vias?
The minimum annular ring on vias is 0.005" (5 mils). each side of the hole. The pad must be large enough to tent over the hole otherwise you may lose the metal in the hole during outer layer etching resulting in plating voids.

What is the closest copper to edge of the printed circuit board?
The closest copper trace and land fills to edge of PC board is 0.010" (10 mils). If the copper runs closer to the edge it may be exposed during board rout.

Are the prototype printed circuit boards electrically tested?
All multi-layer (4, 6, 8 and 10 layer) PCB prototypes come electrically tested as part of the service. Two-layer boards are not tested.

Can you handle controlled impedance requirements?
No. This feature is not available through the US Quickturn PCBs service. However, you may submit a Custom_RFQ for complete prototype circuit board manufacturing needs.

To what acceptability standards do you build?
PCBs are built to IPC-A-6011/6012 latest revision Class 2 with inspection based on IPC-A-600 latest revision.

What is OSP finish?
OSP (Organic Solderability Preservative) is a thin organic coating deposited on the exposed copper. The coating preserves the solderability of the copper surface, while allowing it to be easily soldered without the need for removal. Excellent solderability is maintained through 3 to 5 I.R. soldering cycles.

What files do you need to manufacture my US Quickturn PCBs?
The following files need to be compressed into one ZIP file and uploaded through the US Quickturn PCBs web site at order placement. Our web application will only accept one ZIP file per order. Your file set needs to be complete with the following data:
1. Gerber files in 274X or 274D formats. (274D format will require an aperture list or environment file)
2. Excellon2 NC drill file.
3. Drill tool list specifying finished hole sizes, hole quantities, and plated/non-plated holes.

How do I send my files?
You will be prompted to upload your files through the web site during order placement. Your files are encrypted and maintained in our secure database.

If you have more questions, please contact our Technical Experts at support@pcbunlimited.com

US Full Spec Printed Circuit Boards

• Manufactured in the US
• Cutting Edge Technology
• Same Day & Weekend Turns available
• Mil spec & ITAR compliant circuit boards

 

PRICE TABLES -- Standard Spec vs. Custom Spec: What’s the Difference?

Deciding whether you need to order your printed circuit boards as a Standard Spec or as a Custom Spec boards is simply a matter of looking at the specs. Standard Spec circuit boards are built to the same standards as Custom Spec orders but with a more limited spec range. Standard Spec and Custom Spec orders are inspected to IPC Class II Standards.

Quantity doesn’t matter. We will make as few as one pcb as either a Standard Spec or Custom Spec order. No order is too small for us!

Quality is the same. All Standard Spec and Custom orders go through the same rigorous fabrication and quality check process.

Turnaround time is the same. We can produce your Custom Spec order just as quickly as our Standard Specs orders even creating them in one day if needed.

Standard Specs include:
 • All holes plated through (PTH) for all hole sizes in the drill program
 • Non-plated slots and cutouts (plated available on Custom Spec orders)
 • Green soldermask
 • FR4 (regular)
 • White legend (silkscreen)
 • 1 oz. Cu. Inner layers/Up to 2 oz. Cu. Wt. on outer layers
 • Overall thickness .031” .062”, .093”, or .125”
 • Trace/Space to 5/5 mils
 • Gold fingers
 • Lead-Free HAL Solder plating finish
 • Rout Tolerance +/- 0.010”
 • Hole Tolerance +/- 0.005”
 • Fiducials and/or Tooling Holes

Custom Specs include:
• Plated or Non-plated holes (if no specifications provided holes will be plated)
• Non-plated or plated slots/edges and cutout's
• Various laminates including high temp (tg) FR4
• Full range of finished printed circuit board thicknesses
• Different soldermask colors (default green)
• Different silkscreen (legend) colors (default white)
• Trace/Space down to 4/4 mils
• UL Markings (Also 94V-O upon request)
• Lead-Free logo markings on printed circuit boards (upon request)
• Controlled Dielectric and/or Controlled Impedance
• Inner layer Cu. Wt. ½ oz. – 3 oz.
• Countersinks/Counterbores
• Fiducials and/or Tooling Holes (no additional charge if requested)
• Hole Tolerance +/- 0.003” (if requested)
• Electrolytic Hard Gold plating finish (total board or gold fingers only) and other plating finishes to include  ENIG,  Soft  Bondable Gold, Nickel, Immersion Silver, and OSP. Also HAL available in both leaded and lead-free solder finishes.

NOTE:
1. We never charge Tooling NRE on Standard Spec orders. In addition, when you re-order your Standard Spec with no changes and go to Custom Spec we waive the tooling charge again.
2. You pay Electrical Test charges only once. If you pay as a Standard Spec you don’t pay again… even for a fixture when going to Custom Spec.

Tolerances and Design Requirements

  1. Inner Layer Clearances
    We require a minimum of 0.010” inner layer clearance.

  2. Copper to Edge of Printed Circuit Board
    Minimum of 0.010” (outer layers) and 0.014” for inner layers (0.020” preferred for inner layers). For scoring, minimum of .015 for outer layers and .020 for inner layers.

  3. Pad Size/Annular Ring
    Pad size should be at least + 0.010” over finished hole size for vias and + 0.014” over finished hole size for component holes. This means the annular ring (radius of the pad) should be at least .005” for vias and a minimum of 0.007” for component holes.

  4. Hole Size
    +/- 0.005”  Standard Spec
    +/- 0.005” Custom Spec default
    +/- 0.003” Custom Spec upon request 1 oz and 2 oz finished copper weight only
    Minimum finished hole size; 0.010”. Call your salesperson if you required a finished hole size less than 0.010”.

  5. Printed Circuit Board Thickness
    Overall may vary +/- 10% (Minimum +/- 0.005”)
    Minimum finished thickness for 2-layer: 0.005” (Call if you need a thickness of less than 0.005”)
    Minimum finished thickness for 4-layers: 0.020”
    Minimum finished thickness for 6-layers: 0.031”
    Minimum finished thickness for 8-layers: 0.047”
    Minimum finished thickness for 10-layers: 0.062”

  6. Inner Layer Thickness
    Tolerances do not apply to the inner layers of Standard Spec Orders.

  7. Rout (Circuit Board Outline)
    +/- 0.010” (+/- 0.005” available for Custom Spec Orders upon request
    Note: We rout to your circuit board size using the center of the board outline on your mask layer.

  8. Copper Trace Width/Spacing
    This is the minimum air gap between any two adjacent copper features. Trace width is the minimum width of a copper feature, usually traces.
    For trace width/spacing, we require a minimum of 0.005” for 1 oz. finished copper weight on outer layers. Premiums are added for trace/space specs less than 0.008”
    For 1 oz. finished copper weight (inner layers), minimum trace width/space is 0.005”
    For 2 oz. finished copper weight (inner & outer), minimum trace width/space is 0.007”
    For 3 oz. finished copper weight (inner & outer), minimum trace width/space is 0.010”
    For 4 oz. f inished copper weight (inner & outer), minimum trace width/space is 0.012

  9. Conductor width, thickness and spacing
    When not specified by the customer, the minimum conductor width shall be 80% of  the pattern supplied by the procurement documentation.  Both internal and external conductor conductor  thickness  tolerance  vary with the weight of the copper foil used for fabrication and  must    meet or exceed values established by IPC-6012.  Conductor  spacing may be reduced by a maximum of 30% (IPC Class2) unless otherwise stated in the documentation.

  10. Soldermask Swell
    This is the expansion of mask relief over pad area. Our minimum is 0.005” over pad dimension or 0.0025” each side. PCB Unlimited will modify files to meet the minimum dimension.

  11. Slot Width
    Minimum 0.031” in width. For smaller width, call your salesperson for pricing and turntime.

  12. Tab Rout Spacing
    Please allow 0.100” spacing between your individual pcbs for tab rout spacing. When scoring there should be no spacing between the circuit boards.

  13. Silkscreen (Legend)
    0.005” minimum line width.

Offshore Printed Circuit Boards

You can now get Cutting Edge PCBs for a Fraction of what you usually pay as fast as 24-Hour Turn!


• State-of-the-Art Facilities
• Best Prices. Prototype & Production quantities
• Free Electrical Test & No Tooling Charges
• Manufactured in China and Taiwan facilities

  Cutting Edge Technology
  • Printed Circuit Boards up to 30 layers
  • 2.5-mil traces and 3.5-mil spaces
  • Minimum drill size 8-mil
  • Blind and Buried Via
  • Controlled Impedance
  • High temperature, high frequency material
  • Aluminum and other special materials
  • RoHs Compliant
  • ISO-9001 and UL certified

  • RIGID BOARDS

    Specification 1 Specification 2 Unit Standard Special
    Inspection standard Quality Inspection   GB/T 16261-1996, IPC-6012 Class II IPC-6012 Class 3 GJB362-96
    Test method   IPC-TM-650, GB/T4677-2002  
    Cam department Accept data   TANGO, PROTEL series, PADS2000, Power PCB, AUTOCAD, PCAD  
    Cam operation software   Genisis, CAM350, GC-CAM  
    General capability Max layer Layer 26 30
    Max board size(high frequency /FR4 material) inch 16x18 / 20x24 22x42
    Min board size(not panel) mm 20*30  
    Min and Max board thickness mm 0.3 - 4.0 5.0
    Min and Max Board Thickness 2-layer mm 0.4 - 4.0 0.3 - 5.0
    Min and Max Board Thickness 4-layer mm 0.6 - 4.0 0.45 - 5.0
    Min and Max Board Thickness 6-layer mm 0.8 - 4.0 0.65 - 5.0
    Min and Max Board Thickness 8-layer mm 1.2 - 4.0 1.0 - 5.0
    Min and Max Board Thickness 10-layer mm 1.5 - 4.0 1.2 - 5.0
    Min and Max Board Thickness 12-layer mm 1.6 - 4.0 1.4 - 5.0
    Min and Max Board Thickness 14-layer mm 1.8 - 4.0 1.65 - 5.0
    Max Aspect Ratio   10:1 (Related min hole size 0.20mm)  
    Min drilling size mm 0.2  
    Max. Inner layer copper finished (oz) oz 3 5
    Max. Outer layer copper finished (oz) oz 4 6
    Min BGA pad diameter (No via pad) mil 10  
    Min SMT/BGA space mil 8  
    FR4 core/prepreg thickness Core thickness
    (base copper Hoz/Hoz, 1oz/1oz)
    mm
    0.080.10.130.15
    0.200.250.360.51
    0.710.801.01.2
    1.52.02.42.5
    3.03.2  
    0.05 H/H
    base copper:
    18/35
    35/70
    70/105
    Prepreg thickness mm 7628=0.185, 2116=0.105, 3313=0.095, 1080=0.075  
      mil
    3.153.945.125.91
    7.879.8414.1720.08
    27.9531.5039.3747.24
    59.0678.7494.4998.43
    118.1125.9  
     
      mil 7628=7.28, 2116=4.13, 3313=3.74, 1080=2.95  
    Special Material Rogers   Ro4350, Ro4350B, Ro4003, Ro4003C, Prepreg:RO4403 (4mil), RO4350(4mil)  
    Arlon   AD350, AR1000, 25FR, 33N, Diclad527, 85N, etc  
    Isola   370HR  
    Halogen-Free (Tg=130)   Shengyi core: S1155, PP: S0155  
    Halogen-Free (TG=170)   Shengyi core: S1165, PP: S0165  
    High TG   Shengyi core : S1170 pp: S070  
    Surface Treatment Surface   HAL, HAL Lead free, Immersion gold, immersion Sn, Immersion silver, OSP, Carbon ink, Flash gold  
    Gold finger   Hard gold, flash gold  
    Impedance Control Material   FR-4, Rogers, Arlon?Taconic  
    Tolerance % ±10 ±5

    Process Capability

    Spec 1 Spec 2 unit Standard Special
    Image transfer Min trace width/space in inner layer 1/2oz base mil 4/4  
    1oz base mil 5/5
    2oz base mil 8/8.5
    3oz base mil 12/10.5
    4oz base mil 18/14
    Min trace width/space in outer layer 1/2oz base mil 4/4.7
    1oz base mil 5/5.2
    2oz base mil 9/9.5
    3oz base mil 12/14
    4oz base mil 18/21
    Compensation to inner layer (Hoz/1oz/2oz/3oz/4oz) mil 0.5/1.0/2.5/3.5/6.0
    Compensation to outer layer (Hoz/1oz/2oz/3oz/4oz) mil 1.2/1.7/4.5/6.0/9.0
    Inner layer isolation ring width(single side) (Min) mil 10(<=6 layer);12(7-14 layer);14(layer>=14)
    Through hole min pad ring size (inner) mil 5(1/2oz,1oz),6(2oz),8(3oz)
    Through hole min pad ring size (outer) mil 4 (before compensation)
    Min inner layer isolation strip width(after compensation) mil 8 7
    Min space from conductor to board edge in inner layer mil 8 7
    Min space from conductor to board edge in outer layer mil 8 6
    Min grid trace width/space finished size mil

    6/6(1/2oz Base); 6/6(1oz Base); 10/8(2oz Base)

    10/10(3oz Base); 12/12(4oz Base)

     
    Min Via pad size(single side)   4 3
    Etching logo line width(Min) mil 8(1/2oz Base); 10(1oz Base); 12(2oz Base)  
    Laminating Min dielectric thickness mm 18um Base)
    Max dielectric thickness(no bare core) mm 7628+2116+7628=0.185+0. 105+0.185=0.475
    Board thickness tol. (T<=1.0mm) mm ±0.1
    Board thickness tol.(T>1.0mm) % ±10(1.0mm<T<=2.4mm),±8(T>2.4mm)
    Twist % 0.7 (NO SMT board);0.5(SMT board) 0.2
    Drilling Drilling size mm 0.2-6.3(step:0.05mm) 0.15
    Min drilling size for High frequency board mm 0.25 0.20
    Min NPTH in first drilling step mm 0.5 0.2
    Hole wall to conductor space(Min) mil 8(<=6layer );10(<=14layer)  
    Min hole to conductor space for blind/buried board mil 9(1 time laminating);10(2 or 3times laminating)
    Min. space from two hole wall in the same network mil 6(after compensation)
    Min space from two hole wall in the diff. network mil 12(after compensation)
    Space from two NPTH wall(Min) mil 8
    Hole position tol. mil ±3
    Press fit hole tol. mil ±6
    Drilling diameter tol. mm 0.04
    Drilling slot tol. mm ±0.15(long side)±0.10(short side)
    Mill cutter diameter mm 0.60--1.20
    Slot length direction/width direction   1.8?1
    Depth tol. of step hole and countersink mm ±0.2 ±0.10
    Tol. of Step hole and countersink mm ±0.15 ±0.10
    Hole angle tol. of step hole and counter sink ° ±10  
    PTH Min. copper thickness in hole um 20
    Solder mask(S/M) S/M type   Nanya LP-4G
    S/M color green, yellow, black, white, red, blue
    S/M opening single side(Min) mil 2
    Min S/M opening width for logo mil 8
    Min S/M opening single side for NPTH mil 4
    S/M bridge(Min) mil 4(green),5(other color)
    S/M hardness H 6
    S/M thickness(corner of the trace)(Min) um 10
    S/M thickness over via um 8-10 15
    S/M over max copper oz 4  
    Plugged via(Max) mm <=0.35 0.4-0.8
    Silkscreen Silkscreen color   white, black, yellow, grey  
    Silkscreen line Width/Height(18um Base) mil 4/27
    Silkscreen line Width/Height(35um Base) mil 5/30
    Silkscreen line Width/Height(70um Base) mil 6/45
    Min space from silkscreen to pads mil 6 4
    Min space between carbon ink pad mil 15 12
    Min space between carbon ink and conductor mil 10 8
    Carbon ink larger than conductor by min. size mil 6 4
    Carbon ink sheet resistance ohm 15  
    Peellable mask   SD-2955,SD-2954, HL-808B(QUNQIANG)
    Silkscreen Peelable mask thickness mm 0.20--0.50
    Peelable mask opening larger than conductor by min size mil 7 6
    Min space from peelable mask to pad(min) mil 16 14
    Max plugged via size for peelable mask mm 5  
    Gold finger Ni thickness standard um 3-5
    Au thickness standard um 0.8-1.3
    Max finger length(max) inch 2
    Finger space(min) mil 7
    Immersion gold Ni thickness standard um 3-6
    Au thickness standard um 0.05--0.075 0.05-0.1
    Immersion Sn Sn thickness mm 0.80-1.20  
    Min board size mm 50*100
    Immersion Ag Ag thickness um 0.10-0.30
    Min board size mm 60*80
    OSP OSP thickness um 0.15-0.30
    Min board size mm 110*110
    HASL Min SMT/BGA pad space mil 6
    Board thickness(finished) mm 0.6-3.0 0.5-4.0
    Sn thickness um 2?40  
    Lead free HASL Sn thickness um 2-40
    Routing Outline tol. mil ±6 ±4
    Milling cutter size(Min) mm 0.8  
    Radius at inner angle(Min) mm 0.5 0.4
    Chamfer angle for gold finger ° 20---60  
    Gold finger chamfer angle tol. ° ±5
    Gold finger chamfer depth tol. mm ±0.20
    Slot size tol.(milling slot) mm ±0.15 ±0.12
    Second drilling step hole tol. mil >=3  
    Second drilling step hole location tol. mil ±5
    V-CUT angle ° 20,30,45,60
    V-CUT angle tol. ° ±5
    V-CUT symmetry tol. mm ±0.05
    V-CUT web thickness tol. mm ±0.1
    Min dis. from V-cut central line to conductor (T<=1.0) mm 0.3(20°),0.33(30°),0.37(45°),0.42(60°)
    Min dis. from V-cut central line to conductor (1.0<=T<=1.6) mm 0.36(20°),0.4(30°),0.5(45°),0.6(60°)
    Min dis. from V-cut central line to conductor (1.6<=T<=2.4) mm 0.42(20°),0.51(30°),0.64(45°),0.8(60°)
    Min dis. from V-cut central line to conductor (2.5<=T<=3.2) mm 0.47(20°),0.59(30°):0.77(45°):0.97(60°)
    Remain thickness tol. of Gold finger after chamfer mil ±5
    Guide trace for gold finger mil 20 10
    Bridge+stamp hole standard design   3drill hole in one bridge, hole wall dis. 0.3mm,4 hole wall, hole size0.6-1.0mm,bridge dis.<=3inch  
    E-test Space form e-test point to board edge mm 0.5
    Resistance for Short ohm 10 7
    Resistance for Opens (min) ohm 5  
    Insulation resistance for Shorts (max) M ohm 100
    Test voltage v 200 500
    electric current (max) mA 200  
    FQC report and test COC report   standard
    Impedance control test standard
    Micro-section test standard
    Thermal shock test  
    Withstanding voltage test
    Ionic contamination test
    Solder ability test
    Insulation resistance test
    Peel-able strength test

    Printed Circuit Board Assembly Services

    • SMT and thru-hole quick turn PCB assembly
    • No minimum or maximum quantity
    • PCBs assembled in as little as 24 hours
    • Guaranteed on-time delivery
    .
    Get a PCB Assembly Quote!

    Types of PCB Assembly Services

    Kitted - You provide all the parts including the bare printed circuit boards and electronic components, we assemble your boards using our state of the art automated equipment.

    Partially Kitted - You provide the "hard to find" parts, the "custom" parts, the parts you have in inventory, whatever parts you have! We help procure the rest of the parts, the PCBs, whatever you don't provide, then assemble your printed circuit boards.

    Full Turn-Key - We manage the entire process from procuring the bare printed circuit boards and all parts through assembly and testing as your application requires.

    Lead-Free PCB Assembly
    We have extensive experience with lead-free and RoHS electronic assembly. Lead-Free presents challenges beyond the traditional leaded PCB assembly. We can guide you through the process and help you produce fully RoHS compliant PCB assemblies.

    Capabilities

    • Prototype PCB assembly to high volume production. Any quantity - one board is ok!
    • Leaded and lead-free solder printed circuit board capabilities
    • No-clean and water clean fluxes
    • Fine pitch to 15 mils
    • Single or double sided SMT (surface mount) assembly
    • Thru-hole assembly
    • Mixed SMT and thru-hole assembly
    • Single or double sided BGA's
    • Passives down to 0402 size
    • Leadless Chip Carriers / CSP
    • BGA to 12 mil pitch
    • Testing
    • XRAY Inspection

    Money-Back Guarantee

    We will refund your money on any project that you are not 100% satisfied with the quality of our workmanship.