US Quick Turn PCBs
Ideal when your prototype printed circuit boards are small (e.g. less than 30 square inches), you only need a few (e.g. less than 20) and you need them soon (1 or 2 days).
- PCBs are Manufactured in our US facilities
- Free electrical test & no tooling charges
- Includes Full DFM Design Review
- Fast 1-2 Day Turns
US Full Service PCBs
Recommended for multilayer (2-14 layers) printed circuit boards and quick turn around time.
- Manufactured in the US
- Cutting Edge Technology
- Same Day & Weekend Turns available
- Mil spec & ITAR compliant circuit boards
Offshore PCBs
Best value for custom printed circuit boards (e.g. immersion gold) or larger quantities (e.g. more than 20) and when the lead time is not too critical (e.g. 5 days).
- State-of-the-Art Facilities
- Best Prices. Prototype & Production quantities
- Free Electrical Test & No Tooling Charges
- Manufactured in China and Taiwan facilities
US QuickTurn Printed Circuit Boards
Our high quality prototype printed circuit boards are manufactured for quick-turn delivery. We offer a prototype-production quality PCB builds including green solder mask resist, HASL or OSP (RoHS) finish, white silk screen legend, and even expedited delivery. What are the standard printed circuit board features?
What Add-Ons are available for the US Quickturn Service? What is the standard shipping schedule for 2 layer PCBs?
What is the shipping schedule for 4, 6, 8 and 10 layer PCBs?
What are the US Quickturn PCBs prices? What types of payments do you accept? If you have more questions, please contact our Technical Experts at support@pcbunlimited.com |
Specs
What is the US QuickTurn PCB manufacturing policy?
1. Orders are not guaranteed to be accepted by us until your files pass our Smart DFM review.
2. We prefer that you pass your design through Smart DFM. This way, you can correct any errors that you find. At the end of the Smart DFM process, you can save a .ezq file. If there are no errors, then we can manufacture your quickturn prototype printed circuit boards directly from the .ezq file. If you get stuck in the middle of the Smart DFM process, you can save and submit your .ezq file to us for additional help.
3. While we prefer that you send us a file after passing it through Smart DFM, you can also choose to send us your raw Gerber and Drill files. We will process your files using Smart DFM and send you an email with a detailed result of the Smart DFM checks. If possible, we will edit your files to remove any Smart DFM violations. Our email to you will detail any changes that we've made and we will send a revised .ezq file that you can load into any of our ViewMate family of products. You can review all of the suggested changes that we've made. If you're happy with our changes, then you can ask us to produce your PCB using the supplied .ezq file. However, we recommend that you change your design in your CAD system so that it passes our Smart DFM checks without requiring any alterations.
4. All files will be retained for 3 months.
5. Orders can be shipped anywhere in the world that is served by UPS or FedEx, so long as no US Export restrictions are in force.
6. We reserve the right to change prices and delivery terms at any time.
If your design contains non-plated holes
Smart DFM places plated and non-plated holes on separate layers. If you run your design through Smart DFM, please remember to check the "Non-Plated Through Holes" check box.
If you send us raw Gerber and Drill files, and your design contains both plated and non-plated holes, then we prefer that you place these holes on separate layers. This will ensure that we understand your intent. If you are using ViewMate Deluxe or ViewMate Pro, then you can also submit your data as a .bin file. Name your plated drill layer "PlatedDrills" and your non-plated drill layer "NonPlatedDrills".
QuickTurn Printed Circuit Boards Outlines
Your prototype printed circuit board outline does not have to be square or rectangular. You can submit round boards or boards with a complex shape. Our requirement is that we can convert your outline to a continuous unbroken path. By default, we will rout your board outline with a 0.0625" diameter rout bit. This will result in a minimum radius of approximately 0.032" on inside corners. If your design contains inside corners with radii of less than 0.032", then we will use a 0.03125" diameter rout tool to cut out your board. In this case, inside corners will have a minimum radius of 0.016".
Routing
Default rout tool diameter is 0.0625".
All features are cut out using this tool if possible (both internal features and the board outline).
Internal Cutouts
Your design can have both plated and non-plated internal cutouts. We suggest that you add one layer for each type of cutout (plated or non-plated). Just place elements in these layers that are the exact shape of the cutout that you want. For example, if you want a 0.050" x 1.00" slot cutout of the board, then just add a trace of this size to the appropriate layer. If you have a more complex shape, then just submit it as one or more polygons that describe the edge of the cutout. We suggest you draw the polygon with an "F-Type" shape (a line of zero width). If you choose, you can draw the polygons with any width trace. We assume that the centerline of the trace describes the edge of your internal cutout. Plated cutouts will have the inside of the cutout plated with the finish that you choose (Tin/Lead or OSP RoHS). Non-plated cutouts will not have any plating on the internal edges. Name your plated cutouts layer "PlatedInternalRouts". Name your non-plated internal routs "NonPlatedInternalRouts". If you wish, you can also supply a drawing that details the internal cutouts and we will create the needed geometry for you. We prefer to use a 0.0625" rout bit for internal cutouts, although we will use a 0.03125" diameter bit if your design contains features with internal radii of less than 0.032".
Solder Mask Swell and "Minimum Web"
When manufacturing your prototype circuit board, there may be a small misregistration between the solder mask layers and the underlying copper layers. As a result, we recommend that you swell your solder mask layer so that it is 0.005" (0.0025" on a side) larger than the underlying copper elements. This way, if there is a misregistration, then your copper pads will not have any solder mask on them. You should also ensure that your design has a "Minimum Web" of at least 0.003" between adjacent pads. Smart DFM can pinpoint any problem areas for you.
Silk Screen Feature Size
We recommend that your silk screen features have a width of at least 0.007", although the absolute minimum for clear legibility is 0.005". If you submit a Smart DFM file with features that are less than 0.005", then we will simply submit your design for manufacture. There is no guarantee that these narrow features will reproduce correctly. If you submit Gerber data or a .bin file to us, then we will modify your silk screen layers if any features are less than 0.007". If possible, we will set all features so that the minimum trace width is 0.007". Where this is impractical, we will reduce the silk screen feature size to a minimum of 0.005".
Do Printed Circuit Boards UL marking?
By default we add a UL marking to the bottom copper layer:

If the large UL logo will not fit on your prototype circuit board, then we will add the smaller logo shown below:

We add a Date Code, a 3 digit order fragment and a Serial Number to the bottom silk screen layer:

2-LAYER PCB
L1 1oz Cu ----------
.059" DIELECTRIC
L2 1oz Cu ----------
4-LAYER PCB
L1 1oz Cu ----------
.0085" DIELECTRIC
L2 .5oz Cu ----------
.039" DIELECTRIC
L3 .5oz Cu ----------
.0085" DIELECTRIC
L4 1oz Cu ----------
6-LAYER PCB
L1 1oz Cu ----------
.0048" DIELECTRIC
L2 .5oz Cu ----------
.020" DIELECTRIC
L3 .5oz Cu ----------
.0048" DIELECTRIC
L4 .5oz Cu ----------
.020" DIELECTRIC
L5 .5oz Cu ----------
.0048" DIELECTRIC
L6 1oz Cu ----------
8-LAYER PCB
L1 1oz Cu ----------
.005" DIELECTRIC
L2 .5oz Cu ----------
.010" DIELECTRIC
L3 .5oz Cu ----------
.005" DIELECTRIC
L4 .5oz Cu ----------
.010" DIELECTRIC
L5 .5oz Cu ----------
.005" DIELECTRIC
L6 .5oz Cu ----------
.010" DIELECTRIC
L7 .5oz Cu ----------
.005" DIELECTRIC
L8 1oz Cu ----------
10-LAYER PCB
L1 1oz Cu ----------
.005" DIELECTRIC
L2 .5oz Cu ----------
.010" DIELECTRIC
L3 .5oz Cu ----------
.005" DIELECTRIC
L4 .5oz Cu ----------
.010" DIELECTRIC
L5 .5oz Cu ----------
.005" DIELECTRIC
L6 .5oz Cu ----------
.010" DIELECTRIC
L7 .5oz Cu ----------
.005" DIELECTRIC
L8 .5oz Cu ----------
.010" DIELECTRIC
L9 .5oz Cu ----------
.005" DIELECTRIC
L10 1oz Cu ----------
What is the minimum trace width allowed?
The minimum traces width is 0.005" (5 mils).
What is the minimum spacing between traces to copper lands?
The minimum gap between traces and copper lands is 0.005" (5 mils).
What is the minimum annular ring on vias?
The minimum annular ring on vias is 0.005" (5 mils). each side of the hole. The pad must be large enough to tent over the hole otherwise you may lose the metal in the hole during outer layer etching resulting in plating voids.
What is the closest copper to edge of the printed circuit board?
The closest copper trace and land fills to edge of PC board is 0.010" (10 mils). If the copper runs closer to the edge it may be exposed during board rout.
Are the prototype printed circuit boards electrically tested?
All multi-layer (4, 6, 8 and 10 layer) PCB prototypes come electrically tested as part of the service. Two-layer boards are not tested.
Can you handle controlled impedance requirements?
No. This feature is not available through the US Quickturn PCBs service. However, you may submit a Custom_RFQ for complete prototype circuit board manufacturing needs.
To what acceptability standards do you build?
PCBs are built to IPC-A-6011/6012 latest revision Class 2 with inspection based on IPC-A-600 latest revision.
What is OSP finish?
OSP (Organic Solderability Preservative) is a thin organic coating deposited on the exposed copper. The coating preserves the solderability of the copper surface, while allowing it to be easily soldered without the need for removal. Excellent solderability is maintained through 3 to 5 I.R. soldering cycles.
What files do you need to manufacture my US Quickturn PCBs?
The following files need to be compressed into one ZIP file and uploaded through the US Quickturn PCBs web site at order placement. Our web application will only accept one ZIP file per order. Your file set needs to be complete with the following data:
1. Gerber files in 274X or 274D formats. (274D format will require an aperture list or environment file)
2. Excellon2 NC drill file.
3. Drill tool list specifying finished hole sizes, hole quantities, and plated/non-plated holes.
How do I send my files?
You will be prompted to upload your files through the web site during order placement. Your files are encrypted and maintained in our secure database.
If you have more questions, please contact our Technical Experts at support@pcbunlimited.com
US Full Spec Printed Circuit Boards
• Manufactured in the US |
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|---|---|
| • Cutting Edge Technology | |
| • Same Day & Weekend Turns available | |
| • Mil spec & ITAR compliant circuit boards |
PRICE TABLES -- Standard Spec vs. Custom Spec: Whats the Difference?
Deciding whether you need to order your printed circuit boards as a Standard Spec or as a Custom Spec boards is simply a matter of looking at the specs.
Standard Spec circuit boards are built to the same standards as Custom Spec orders but with a more limited spec range.
Standard Spec and Custom Spec orders are inspected to IPC Class II Standards.
Quantity doesnt matter.
We will make as few as one pcb as either a Standard Spec or Custom Spec order.
No order is too small for us!
Quality is the same.
All Standard Spec and Custom orders go through the same rigorous fabrication and quality check process.
Turnaround time is the same. We can produce your Custom Spec order just as quickly as our Standard Specs orders even creating them in one day if needed.
Standard Specs include:
All holes plated through (PTH) for all hole sizes in the drill program
Non-plated slots and cutouts (plated available on Custom Spec orders)
Green soldermask
FR4 (regular)
White legend (silkscreen)
1 oz. Cu. Inner layers/Up to 2 oz. Cu. Wt. on outer layers
Overall thickness .031 .062, .093, or .125
Trace/Space to 5/5 mils
Gold fingers
Lead-Free HAL Solder plating finish
Rout Tolerance +/- 0.010
Hole Tolerance +/- 0.005
Fiducials and/or Tooling Holes
Custom Specs include:
Plated or Non-plated holes (if no specifications provided holes will be plated)
Non-plated or plated slots/edges and cutout's
Various laminates including high temp (tg) FR4
Full range of finished printed circuit board thicknesses
Different soldermask colors (default green)
Different silkscreen (legend) colors (default white)
Trace/Space down to 4/4 mils
UL Markings (Also 94V-O upon request)
Lead-Free logo markings on printed circuit boards (upon request)
Controlled Dielectric and/or Controlled Impedance
Inner layer Cu. Wt. ½ oz. 3 oz.
Countersinks/Counterbores
Fiducials and/or Tooling Holes (no additional charge if requested)
Hole Tolerance +/- 0.003 (if requested)
Electrolytic Hard Gold plating finish (total board or gold fingers only) and other plating finishes to include ENIG, Soft Bondable Gold, Nickel, Immersion Silver, and OSP. Also HAL available in both leaded and lead-free solder finishes.
NOTE:
1. We never charge Tooling NRE on Standard Spec orders. In addition, when you re-order your Standard Spec with no changes and go to Custom Spec we waive the tooling charge again.
2. You pay Electrical Test charges only once. If you pay as a Standard Spec you dont pay again
even for a fixture when going to Custom Spec.
Tolerances and Design Requirements
- Inner Layer Clearances
We require a minimum of 0.010 inner layer clearance.
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Copper to Edge of Printed Circuit Board
Minimum of 0.010 (outer layers) and 0.014 for inner layers (0.020 preferred for inner layers). For scoring, minimum of .015 for outer layers and .020 for inner layers.
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Pad Size/Annular Ring
Pad size should be at least + 0.010 over finished hole size for vias and + 0.014 over finished hole size for component holes. This means the annular ring (radius of the pad) should be at least .005 for vias and a minimum of 0.007 for component holes.
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Hole Size
+/- 0.005 Standard Spec
+/- 0.005 Custom Spec default
+/- 0.003 Custom Spec upon request 1 oz and 2 oz finished copper weight only
Minimum finished hole size; 0.010. Call your salesperson if you required a finished hole size less than 0.010.
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Printed Circuit Board Thickness
Overall may vary +/- 10% (Minimum +/- 0.005)
Minimum finished thickness for 2-layer: 0.005 (Call if you need a thickness of less than 0.005)
Minimum finished thickness for 4-layers: 0.020
Minimum finished thickness for 6-layers: 0.031
Minimum finished thickness for 8-layers: 0.047
Minimum finished thickness for 10-layers: 0.062
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Inner Layer Thickness
Tolerances do not apply to the inner layers of Standard Spec Orders.
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Rout (Circuit Board Outline)
+/- 0.010 (+/- 0.005 available for Custom Spec Orders upon request
Note: We rout to your circuit board size using the center of the board outline on your mask layer.
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Copper Trace Width/Spacing
This is the minimum air gap between any two adjacent copper features. Trace width is the minimum width of a copper feature, usually traces.
For trace width/spacing, we require a minimum of 0.005 for 1 oz. finished copper weight on outer layers. Premiums are added for trace/space specs less than 0.008
For 1 oz. finished copper weight (inner layers), minimum trace width/space is 0.005
For 2 oz. finished copper weight (inner & outer), minimum trace width/space is 0.007
For 3 oz. finished copper weight (inner & outer), minimum trace width/space is 0.010
For 4 oz. f inished copper weight (inner & outer), minimum trace width/space is 0.012
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Conductor width, thickness and spacing
When not specified by the customer, the minimum conductor width shall be 80% of the pattern supplied by the procurement documentation. Both internal and external conductor conductor thickness tolerance vary with the weight of the copper foil used for fabrication and must meet or exceed values established by IPC-6012. Conductor spacing may be reduced by a maximum of 30% (IPC Class2) unless otherwise stated in the documentation.
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Soldermask Swell
This is the expansion of mask relief over pad area. Our minimum is 0.005 over pad dimension or 0.0025 each side. PCB Unlimited will modify files to meet the minimum dimension.
- Slot Width
Minimum 0.031 in width. For smaller width, call your salesperson for pricing and turntime. - Tab Rout Spacing
Please allow 0.100 spacing between your individual pcbs for tab rout spacing. When scoring there should be no spacing between the circuit boards. - Silkscreen (Legend)
0.005 minimum line width.
Offshore Printed Circuit Boards
You can now get Cutting Edge PCBs for a Fraction of what you usually pay as fast as 24-Hour Turn!
• State-of-the-Art Facilities |
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| • Best Prices. Prototype & Production quantities | |
| • Free Electrical Test & No Tooling Charges | |
| • Manufactured in China and Taiwan facilities |
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Cutting Edge Technology
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RIGID BOARDS |
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| Specification 1 | Specification 2 | Unit | Standard | Special | ||||||||||||||||||||
| Inspection standard | Quality Inspection | GB/T 16261-1996, IPC-6012 Class II | IPC-6012 Class 3 GJB362-96 | |||||||||||||||||||||
| Test method | IPC-TM-650, GB/T4677-2002 | |||||||||||||||||||||||
| Cam department | Accept data | TANGO, PROTEL series, PADS2000, Power PCB, AUTOCAD, PCAD | ||||||||||||||||||||||
| Cam operation software | Genisis, CAM350, GC-CAM | |||||||||||||||||||||||
| General capability | Max layer | Layer | 26 | 30 | ||||||||||||||||||||
| Max board size(high frequency /FR4 material) | inch | 16x18 / 20x24 | 22x42 | |||||||||||||||||||||
| Min board size(not panel) | mm | 20*30 | ||||||||||||||||||||||
| Min and Max board thickness | mm | 0.3 - 4.0 | 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 2-layer | mm | 0.4 - 4.0 | 0.3 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 4-layer | mm | 0.6 - 4.0 | 0.45 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 6-layer | mm | 0.8 - 4.0 | 0.65 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 8-layer | mm | 1.2 - 4.0 | 1.0 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 10-layer | mm | 1.5 - 4.0 | 1.2 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 12-layer | mm | 1.6 - 4.0 | 1.4 - 5.0 | |||||||||||||||||||||
| Min and Max Board Thickness 14-layer | mm | 1.8 - 4.0 | 1.65 - 5.0 | |||||||||||||||||||||
| Max Aspect Ratio | 10:1 (Related min hole size 0.20mm) | |||||||||||||||||||||||
| Min drilling size | mm | 0.2 | ||||||||||||||||||||||
| Max. Inner layer copper finished (oz) | oz | 3 | 5 | |||||||||||||||||||||
| Max. Outer layer copper finished (oz) | oz | 4 | 6 | |||||||||||||||||||||
| Min BGA pad diameter (No via pad) | mil | 10 | ||||||||||||||||||||||
| Min SMT/BGA space | mil | 8 | ||||||||||||||||||||||
| FR4 core/prepreg thickness | Core thickness (base copper Hoz/Hoz, 1oz/1oz) |
mm |
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0.05 H/H base copper: 18/35 35/70 70/105 |
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| Prepreg thickness | mm | 7628=0.185, 2116=0.105, 3313=0.095, 1080=0.075 | ||||||||||||||||||||||
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| mil | 7628=7.28, 2116=4.13, 3313=3.74, 1080=2.95 | |||||||||||||||||||||||
| Special Material | Rogers | Ro4350, Ro4350B, Ro4003, Ro4003C, Prepreg:RO4403 (4mil), RO4350(4mil) | ||||||||||||||||||||||
| Arlon | AD350, AR1000, 25FR, 33N, Diclad527, 85N, etc | |||||||||||||||||||||||
| Isola | 370HR | |||||||||||||||||||||||
| Halogen-Free (Tg=130) | Shengyi core: S1155, PP: S0155 | |||||||||||||||||||||||
| Halogen-Free (TG=170) | Shengyi core: S1165, PP: S0165 | |||||||||||||||||||||||
| High TG | Shengyi core : S1170 pp: S070 | |||||||||||||||||||||||
| Surface Treatment | Surface | HAL, HAL Lead free, Immersion gold, immersion Sn, Immersion silver, OSP, Carbon ink, Flash gold | ||||||||||||||||||||||
| Gold finger | Hard gold, flash gold | |||||||||||||||||||||||
| Impedance Control | Material | FR-4, Rogers, Arlon?Taconic | ||||||||||||||||||||||
| Tolerance | % | ±10 | ±5 | |||||||||||||||||||||
Process Capability |
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| Spec 1 | Spec 2 | unit | Standard | Special | |
| Image transfer | Min trace width/space in inner layer | 1/2oz base | mil | 4/4 | |
| 1oz base | mil | 5/5 | |||
| 2oz base | mil | 8/8.5 | |||
| 3oz base | mil | 12/10.5 | |||
| 4oz base | mil | 18/14 | |||
| Min trace width/space in outer layer | 1/2oz base | mil | 4/4.7 | ||
| 1oz base | mil | 5/5.2 | |||
| 2oz base | mil | 9/9.5 | |||
| 3oz base | mil | 12/14 | |||
| 4oz base | mil | 18/21 | |||
| Compensation to inner layer (Hoz/1oz/2oz/3oz/4oz) | mil | 0.5/1.0/2.5/3.5/6.0 | |||
| Compensation to outer layer (Hoz/1oz/2oz/3oz/4oz) | mil | 1.2/1.7/4.5/6.0/9.0 | |||
| Inner layer isolation ring width(single side) (Min) | mil | 10(<=6 layer);12(7-14 layer);14(layer>=14) | |||
| Through hole min pad ring size (inner) | mil | 5(1/2oz,1oz),6(2oz),8(3oz) | |||
| Through hole min pad ring size (outer) | mil | 4 (before compensation) | |||
| Min inner layer isolation strip width(after compensation) | mil | 8 | 7 | ||
| Min space from conductor to board edge in inner layer | mil | 8 | 7 | ||
| Min space from conductor to board edge in outer layer | mil | 8 | 6 | ||
| Min grid trace width/space finished size | mil | 6/6(1/2oz Base); 6/6(1oz Base); 10/8(2oz Base) 10/10(3oz Base); 12/12(4oz Base) |
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| Min Via pad size(single side) | 4 | 3 | |||
| Etching logo line width(Min) | mil | 8(1/2oz Base); 10(1oz Base); 12(2oz Base) | |||
| Laminating | Min dielectric thickness | mm | 18um Base) | ||
| Max dielectric thickness(no bare core) | mm | 7628+2116+7628=0.185+0. 105+0.185=0.475 | |||
| Board thickness tol. (T<=1.0mm) | mm | ±0.1 | |||
| Board thickness tol.(T>1.0mm) | % | ±10(1.0mm<T<=2.4mm),±8(T>2.4mm) | |||
| Twist | % | 0.7 (NO SMT board);0.5(SMT board) | 0.2 | ||
| Drilling | Drilling size | mm | 0.2-6.3(step:0.05mm) | 0.15 | |
| Min drilling size for High frequency board | mm | 0.25 | 0.20 | ||
| Min NPTH in first drilling step | mm | 0.5 | 0.2 | ||
| Hole wall to conductor space(Min) | mil | 8(<=6layer );10(<=14layer) | |||
| Min hole to conductor space for blind/buried board | mil | 9(1 time laminating);10(2 or 3times laminating) | |||
| Min. space from two hole wall in the same network | mil | 6(after compensation) | |||
| Min space from two hole wall in the diff. network | mil | 12(after compensation) | |||
| Space from two NPTH wall(Min) | mil | 8 | |||
| Hole position tol. | mil | ±3 | |||
| Press fit hole tol. | mil | ±6 | |||
| Drilling diameter tol. | mm | 0.04 | |||
| Drilling slot tol. | mm | ±0.15(long side)±0.10(short side) | |||
| Mill cutter diameter | mm | 0.60--1.20 | |||
| Slot length direction/width direction | 1.8?1 | ||||
| Depth tol. of step hole and countersink | mm | ±0.2 | ±0.10 | ||
| Tol. of Step hole and countersink | mm | ±0.15 | ±0.10 | ||
| Hole angle tol. of step hole and counter sink | ° | ±10 | |||
| PTH | Min. copper thickness in hole | um | 20 | ||
| Solder mask(S/M) | S/M type | Nanya LP-4G | |||
| S/M color | green, yellow, black, white, red, blue | ||||
| S/M opening single side(Min) | mil | 2 | |||
| Min S/M opening width for logo | mil | 8 | |||
| Min S/M opening single side for NPTH | mil | 4 | |||
| S/M bridge(Min) | mil | 4(green),5(other color) | |||
| S/M hardness | H | 6 | |||
| S/M thickness(corner of the trace)(Min) | um | 10 | |||
| S/M thickness over via | um | 8-10 | 15 | ||
| S/M over max copper | oz | 4 | |||
| Plugged via(Max) | mm | <=0.35 | 0.4-0.8 | ||
| Silkscreen | Silkscreen color | white, black, yellow, grey | |||
| Silkscreen line Width/Height(18um Base) | mil | 4/27 | |||
| Silkscreen line Width/Height(35um Base) | mil | 5/30 | |||
| Silkscreen line Width/Height(70um Base) | mil | 6/45 | |||
| Min space from silkscreen to pads | mil | 6 | 4 | ||
| Min space between carbon ink pad | mil | 15 | 12 | ||
| Min space between carbon ink and conductor | mil | 10 | 8 | ||
| Carbon ink larger than conductor by min. size | mil | 6 | 4 | ||
| Carbon ink sheet resistance | ohm | 15 | |||
| Peellable mask | SD-2955,SD-2954, HL-808B(QUNQIANG) | ||||
| Silkscreen | Peelable mask thickness | mm | 0.20--0.50 | ||
| Peelable mask opening larger than conductor by min size | mil | 7 | 6 | ||
| Min space from peelable mask to pad(min) | mil | 16 | 14 | ||
| Max plugged via size for peelable mask | mm | 5 | |||
| Gold finger | Ni thickness standard | um | 3-5 | ||
| Au thickness standard | um | 0.8-1.3 | |||
| Max finger length(max) | inch | 2 | |||
| Finger space(min) | mil | 7 | |||
| Immersion gold | Ni thickness standard | um | 3-6 | ||
| Au thickness standard | um | 0.05--0.075 | 0.05-0.1 | ||
| Immersion Sn | Sn thickness | mm | 0.80-1.20 | ||
| Min board size | mm | 50*100 | |||
| Immersion Ag | Ag thickness | um | 0.10-0.30 | ||
| Min board size | mm | 60*80 | |||
| OSP | OSP thickness | um | 0.15-0.30 | ||
| Min board size | mm | 110*110 | |||
| HASL | Min SMT/BGA pad space | mil | 6 | ||
| Board thickness(finished) | mm | 0.6-3.0 | 0.5-4.0 | ||
| Sn thickness | um | 2?40 | |||
| Lead free HASL | Sn thickness | um | 2-40 | ||
| Routing | Outline tol. | mil | ±6 | ±4 | |
| Milling cutter size(Min) | mm | 0.8 | |||
| Radius at inner angle(Min) | mm | 0.5 | 0.4 | ||
| Chamfer angle for gold finger | ° | 20---60 | |||
| Gold finger chamfer angle tol. | ° | ±5 | |||
| Gold finger chamfer depth tol. | mm | ±0.20 | |||
| Slot size tol.(milling slot) | mm | ±0.15 | ±0.12 | ||
| Second drilling step hole tol. | mil | >=3 | |||
| Second drilling step hole location tol. | mil | ±5 | |||
| V-CUT angle | ° | 20,30,45,60 | |||
| V-CUT angle tol. | ° | ±5 | |||
| V-CUT symmetry tol. | mm | ±0.05 | |||
| V-CUT web thickness tol. | mm | ±0.1 | |||
| Min dis. from V-cut central line to conductor (T<=1.0) | mm | 0.3(20°),0.33(30°),0.37(45°),0.42(60°) | |||
| Min dis. from V-cut central line to conductor (1.0<=T<=1.6) | mm | 0.36(20°),0.4(30°),0.5(45°),0.6(60°) | |||
| Min dis. from V-cut central line to conductor (1.6<=T<=2.4) | mm | 0.42(20°),0.51(30°),0.64(45°),0.8(60°) | |||
| Min dis. from V-cut central line to conductor (2.5<=T<=3.2) | mm | 0.47(20°),0.59(30°):0.77(45°):0.97(60°) | |||
| Remain thickness tol. of Gold finger after chamfer | mil | ±5 | |||
| Guide trace for gold finger | mil | 20 | 10 | ||
| Bridge+stamp hole standard design | 3drill hole in one bridge, hole wall dis. 0.3mm,4 hole wall, hole size0.6-1.0mm,bridge dis.<=3inch | ||||
| E-test | Space form e-test point to board edge | mm | 0.5 | ||
| Resistance for Short | ohm | 10 | 7 | ||
| Resistance for Opens (min) | ohm | 5 | |||
| Insulation resistance for Shorts (max) | M ohm | 100 | |||
| Test voltage | v | 200 | 500 | ||
| electric current (max) | mA | 200 | |||
| FQC report and test | COC report | standard | |||
| Impedance control test | standard | ||||
| Micro-section test | standard | ||||
| Thermal shock test | |||||
| Withstanding voltage test | |||||
| Ionic contamination test | |||||
| Solder ability test | |||||
| Insulation resistance test | |||||
| Peel-able strength test | |||||
Printed Circuit Board Assembly Services
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Types of PCB Assembly Services
Kitted - You provide all the parts including the bare printed circuit boards and electronic components, we assemble your boards using our state of the art automated equipment.Partially Kitted - You provide the "hard to find" parts, the "custom" parts, the parts you have in inventory, whatever parts you have! We help procure the rest of the parts, the PCBs, whatever you don't provide, then assemble your printed circuit boards.
Full Turn-Key - We manage the entire process from procuring the bare printed circuit boards and all parts through assembly and testing as your application requires.
Lead-Free PCB Assembly
We have extensive experience with lead-free and RoHS electronic assembly. Lead-Free presents challenges beyond the traditional leaded PCB assembly. We can guide you through the process and help you produce fully RoHS compliant PCB assemblies.
Capabilities
- Prototype PCB assembly to high volume production. Any quantity - one board is ok!
- Leaded and lead-free solder printed circuit board capabilities
- No-clean and water clean fluxes
- Fine pitch to 15 mils
- Single or double sided SMT (surface mount) assembly
- Thru-hole assembly
- Mixed SMT and thru-hole assembly
- Single or double sided BGA's
- Passives down to 0402 size
- Leadless Chip Carriers / CSP
- BGA to 12 mil pitch
- Testing
- XRAY Inspection


